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Silicon Wafers
MEMS Wafer Line
MEMS SSP and DSP Wafers
Selecting the ideal wafer for MEMS devices: Balancing cost, performance, and manufacturing efficiency
RFSi® Wafer Line – High Resistivity for RF
High Resistivity Wafers
Engineered High Resistivity Wafers with Trap-Rich Layer
Engineered Ultra High Resistivity wafers
UF-RFSi® – Ultra Flat High Resistivity Wafers
High Resistivity BSOI Wafers
RF GaN Substrate wafers
Power Wafer Line
Power Management SOI wafers
Power GaN Substrate wafers (Si and SOI)
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SOI Wafers – Silicon-On-Insulator Line
BSOI Wafers – Bonded SOI
C-SOI® Wafers – Cavity SOI
E-SOI® Wafers – Enhanced SOI
Terrace Free SOI wafers
Patterned Wafers – DRIE and Lithography
TSV Wafers – Through Silicon Via
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Season’s Greetings from Okmetic
ECS Summer School 2024 brought students comprehensive knowledge of semiconductor industry
Enhancing PMUT performance with C-SOI® and EC-SOI wafers: Results from VTT – Okmetic collaboration
Okmetic participating in projects bridging the RF frequency gap
Okmetic participating in CMC Seminar 23 October
Okmetic is participating in MSEC
Okmetic will be participating in ISES US Power
Okmetic participates in the ECSA project to respond to the shortage of semiconductor professionals
Okmetic is participating in SEMICON Taiwan
Okmetic participating Beijing Microelectronics International Symposium
Jim Reed held a speech at Semicon West 2024
Okmetic commits to Science Based Targets Initiative (SBTi) to strengthen its sustainability work
The Sustainability Report for 2023 has been published
COP level management enhancing power device reliability and yield
New strategy outlines growth opportunities for Finnish semiconductor industry
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