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Silicon Wafers
MEMS Wafer Line
MEMS SSP and DSP Wafers
Selecting the ideal wafer for MEMS devices: Balancing cost, performance, and manufacturing efficiency
RFSi® Wafer Line – High Resistivity for RF
High Resistivity Wafers
Engineered High Resistivity Wafers with Trap-Rich Layer
Engineered Ultra High Resistivity wafers
UF-RFSi® – Ultra Flat High Resistivity Wafers
High Resistivity BSOI Wafers
RF GaN Substrate wafers
Power Wafer Line
Power Management SOI wafers
Power GaN Substrate wafers (Si and SOI)
Discrete Power Device wafers
SOI Wafers – Silicon-On-Insulator Line
BSOI Wafers – Bonded SOI
C-SOI® Wafers – Cavity SOI
E-SOI® Wafers – Enhanced SOI
Terrace Free SOI wafers
Patterned Wafers – DRIE and Lithography
TSV Wafers – Through Silicon Via
DSP Wafers – Double Side Polished
SSP Wafers – Single Side Polished
Customized Wafers and Prototyping
Production and Capacity Expansion
Supplier Awards and Collaboration Projects
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MEMS and Sensors
RF Filters and Devices
Power Devices
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Artificial Intelligence at Okmetic
5S at Okmetic
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Okmetic participating in CMC Seminar 23 October
Okmetic is participating in MSEC
Okmetic will be participating in ISES US Power
Okmetic participates in the ECSA project to respond to the shortage of semiconductor professionals
Okmetic is participating in SEMICON Taiwan
Okmetic participating Beijing Microelectronics International Symposium
Jim Reed held a speech at Semicon West 2024
Okmetic commits to Science Based Targets Initiative (SBTi) to strengthen its sustainability work
The Sustainability Report for 2023 has been published
COP level management enhancing power device reliability and yield
New strategy outlines growth opportunities for Finnish semiconductor industry
Join Okmetic at IMS2024 on 16-21 June 2024, in Washington, DC
Katja Parkkinen held a speech at Incize RF Workshop
Dr. Akiko Gädda gave a speech at the MEF
Okmetic participated in CMC Techcet event
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