Okmetic is participating in the IEEE MEMS Conference 2024, to be held in Austin, Texas

Okmetic is participating in the IEEE MEMS Conference 2024, to be held in Austin, Texas from Jan.21 to Jan.25. Our Senior Customer Support Manager Petri Santala will be giving a speech titled “Bonded SOI and Cavity SOI enabling Enhanced MEMS Designs”. Don’t miss your opportunity to hear about Okmetic SOI solutions providing an optimal platform for the manufacture of demanding MEMS devices. Our Bonded SOI wafers and use of hermetically sealed structures enabled by Cavity SOI (C-SOI^®) wafers drive for MEMS device miniaturization, cost-efficiency and more streamlined production in addition to better performance and additional design freedom.

Learn more about Okmetic’s SOI wafers here. And you may want to check out the conference registration.