Past R&D projects
Moore4Medical (2020-2023)
Moore4Medical was an EU-wide Ecsel project (66 partners and 12 countries) with a goal to develop open technology platforms for new types of electronic medical devices. In the project, Okmetic’s C-SOI® wafers were used in a PMUT-based (piezoelectric micromachined ultrasound transducer) ultrasonic power transfer platform that enables wireless charging of medical implants from outside the body.
AI to enhance wafer quality and semiconductor device reliability
The use of artificial intelligence is expected to surge in the semiconductor industry. Using AI in wafer manufacturing enables early detection of smaller defects, resulting in enhanced wafer quality and cost-efficiency. Intelligent Reliability 4.0 project speeded Okmetic AI model creation and brought also other advances.
Intelligence reliability 4.0 (2020-2023)
We were involved in the Intelligence reliability 4.0 (iRel40) project to develop the reliability of electronical components and systems with artificial intelligence. The iRel40 project aimed to reduce the number of faults in the value chain, from crystal growing to product modules. In the project, Okmetic especially focused on improving the reliability of the interface of C-SOI® wafers with machine learning and artificial intelligence.
Position-II (2018-2021)
During 2018–2021, we were involved in the POSITION-II project by creating a pilot line for the next generation of smart catheters and implants. The project aimed to integrate many scalable and open technical platforms into one production network. Okmetic contributed to the project by establishing a new patterning line, as well as developing new crystal growing technology and patterned specialty SOI wafers for the implementation of smart catheters and implants.
AutoDrive (2017-2020)
During 2017–2020, we were involved in the AutoDrive project, which developed electronics and embedded software systems for automatic driving. The project aimed to take future driving into a safer and more efficient direction. Okmetic contributed to the project by developing strongly doped C-SOI® wafers that can be used in the new generation of sensors.